Solder paste printing steel screen
Features: Rare metal nano coating with self-cleaning ability. Reduces tin residue and improves solder paste molding.
Solder Paste Stencil is a key tool used in surface mount technology (SMT) for applying solder paste to printed circuit board (PCB) pads to facilitate the adhesion of components to the pads in subsequent processes.
High accuracy of mesh
Solder paste stencil is usually made of stainless steel or nickel, which has high strength and corrosion resistance, high surface smoothness, and high precision of mesh holes. The manufacturing process of solder paste stencil is more delicate than ordinary printing stencil, requiring higher processing precision and quality control to ensure the thickness and uniformity of solder paste meet the specifications and quality requirements.
High reliability
In the SMT manufacturing process, solder paste stencils are used to evenly coat the solder pads of PCBs, and then the components are adhered to the pads by the mounting machine to finalize the manufacturing of electronic products. The quality and accuracy of the solder paste stencil has an important impact on the solder quality and component reliability in the SMT manufacturing process.
Contrast
Technical Support：Shenzhen Tianhe Xingye Optoelectronics Co.