In the electronic manufacturing industry, X-ray inspection technology is widely used in the inspection and analysis of electronic components such as printed circuit boards (PCBs), package wafers, BGA wafers, transistors, etc. It is used to detect defects in these components such as solder quality, poor contact, air bubbles, cracks, and internal structures to ensure product quality and reliability.

Specifically, X-ray inspection technology can detect the following defects and errors:

1. Welding quality: detect the quality of welding joints, such as welding defects, false welding, bad welding, etc.
2. Poor contact: Check whether the contact status between components and PCB is good.
3. Defect detection: detecting defects inside components, such as air bubbles, cracks, cavities, etc.
4. Component structure: Inspection of the internal structure of components, pins, etc.
5. Performance test: to check the performance of components, such as capacity, resistance value, etc.

By using X-ray inspection technology, high precision, high efficiency and high accuracy inspection and analysis can be achieved, reducing errors and defects caused by human factors and improving product quality and reliability.