SPI
SPI (Solder Paste Inspection) is a technology used in electronic manufacturing to check the quality and reliability of solder paste used in the inspection of laminated components on PCBs. Solder paste is a mixture of a solid metal powder and a liquid solder that is used to form electrical connections on PCBs.
SPI Technology uses high-resolution monitors and image processing software to automate the inspection and analysis of the quality of solder paste on PCBs. By examining parameters such as height, shape, area, position and defects of the solder paste, it is possible to determine whether the solder meets the specification requirements. The main target of inspection is the solder quality on the PCB, including solder defects, dummy solder, over solder, etc.
Specifically, SPI technology can detect the following solder paste quality problems:
1. Solder paste height and shape: Check if the paste height and shape meet the specifications.
2. Position and offset: Check whether the position of the solder paste is correct and whether there is any position deviation.
3.Quality: Check the quality of the solder paste, such as voids, defects, dummy solder, over solder, etc.
4. Ball Solder Paste: Check the quality and location of the ball solder paste.
By using SPI technology, the quality and reliability of PCB solder paste can be greatly improved, reducing errors and defects caused by human factors, thus improving the overall product quality.